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Product Description:
EP 8108 is a single-component, modified epoxy resin adhesive used for BGA (Ball Grid Array) and CSP (Chip Scale Package) bottom filling processes. It forms a uniform, defect-free bottom fill layer that effectively reduces the mismatch in the overall thermal expansion properties between the silicon chip and substrate, as well as the impact caused by external forces. Once cured by heat, the adhesive improves the mechanical strength of the chip connection and enhances the product's performance, thereby extending its lifespan.

Storage and Shelf Life:

• The product should be stored in vacuum-sealed aluminum foil bags in a dry environment, with a temperature range of 15°C to 25°C.

• The shelf life of unopened product is 6 months.

Health and Safety Measures:

• Please refer to the Material Safety Data Sheet (MSDS) for proper handling and disposal instructions.

Limited Warranty Information – Please Read Carefully:
The information provided herein is accurate to the best of our knowledge. However, since the conditions and methods of use are beyond our control, this information cannot replace customer testing to ensure the product’s safety, effectiveness, and suitability for specific end uses. Our recommendations should not be considered a basis for patent infringement.

This document does not include all safety information required for the safe use of the product. Please read the product's safety data sheet and container labels before use to obtain information about safe handling and health hazards.